| 摘要 |
This resin substrate (10) is provided with a dielectric element (20), first and second ground conductors (50, 40), and shield tapes (60). The dielectric element (20) has a foldable shape. The dielectric element (20) is provided with a signal conductor (30) at a halfway position in the thickness direction. The first ground conductor (50) is arranged on the front surface of the dielectric element (20), and the second ground conductor (40) is arranged on the back surface of the dielectric element (20). A folded part (102) of the first ground conductor (50) is provided with a non-conductor-formation part (500), and a folded part (102) of the second ground conductor (40) is provided with a non-conductor-formation part (400). The shield tapes (60) are arranged at the folded parts (102), and cover the non-conductor-formation parts (400, 500), respectively. The shield tapes (60) are respectively connected to the first and second ground conductors (50, 40), and have electromagnetic shielding properties. |
