Control of warpage using ABF GC cavity for embedded die package

摘要

A glass fibre layer 210 provides rigidity to a coreless die package. The die is arranged in a cavity formed by using laser ablation of the glass fibre package stiffening layer. Build-up interconnect and dielectric layers are further provided in the device package. The stiffness of the package may be controlled by adding additional stiffening glass fibre layers to the package or by varying the size of the gap between the sidewall of the die and the sidewall of the glass fibre cavity.