| 摘要 |
The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1),
component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging. |
