发明名称 |
IMPEDANCE MATCHING CONFIGURATION INCLUDING BONDWIRES |
摘要 |
A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching network is coupled to the second terminal and comprises a first inductor and a first capacitor. The first inductor comprises first bond wire connections coupled between the second terminal and a first bond pad on the die, and second bond wire connections coupled between the first bond pad and a second bond pad coupled to the first capacitor. |
申请公布号 |
EP3098849(A1) |
申请公布日期 |
2016.11.30 |
申请号 |
EP20150169491 |
申请日期 |
2015.05.27 |
申请人 |
AMPLEON NETHERLANDS B.V. |
发明人 |
ZHU, YI;VAN DER ZANDEN, JOSEPHUS;VOLOKHINE, IOURI;HEERES, ROB MATHIJS |
分类号 |
H01L23/66;H01L23/49;H03F1/56 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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