发明名称 半導体製造装置、半導体製造方法、および半導体ウェーハホルダ
摘要 A semiconductor manufacturing apparatus includes a chamber, a reaction-gas inlet, a gas exhaust port, a rotation unit, a semiconductor wafer holder, a heater, and a purge-gas inlet. The wafer holder includes a first hold region to hold the semiconductor wafer and a second hold region held by the rotation unit. The second hold region surrounds the first hold region. The level of the first hold region and the level of the second hold region differ. A plurality of ventholes is provided to the first hold region so that the ventholes are just below a sidewall of the semiconductor wafer held by the first hold region.
申请公布号 JP6034771(B2) 申请公布日期 2016.11.30
申请号 JP20130196216 申请日期 2013.09.20
申请人 株式会社東芝 发明人 東 真也;佐藤 慎哉;佐久間 智教;大澤 明彦;小林 浩秋;山崎 修;西村 博司
分类号 H01L21/205;C23C16/458;H01L21/3065;H01L21/683 主分类号 H01L21/205
代理机构 代理人
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