发明名称 |
THIN FILM AND FORMING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin film which is formed on a p-type semiconductor region and which can produce a high passivation effect; and provide a forming method of the thin film.SOLUTION: A thin film forming method comprises: a step of storing inside a chamber, a semiconductor substrate having a principal surface of a p-type semiconductor region; a step of exciting plasma of a hydrogen-containing process gas inside the chamber; a step of exposing the principal surface to the plasma of the process gas to cause a hydrogen radical to form a bond with a dangling bond of the semiconductor substrate; a step of exciting plasma of a material gas inside the chamber by hollow cathode discharge using AC power of a frequency of not less than 40 kHz and not more than 550 kHz; and a step of exposing the principal surface to the plasma containing the material gas to form a thin film which is made of a silicon nitride film and has a refraction index of 2.25 and over in contact with the principal surface.SELECTED DRAWING: Figure 6 |
申请公布号 |
JP2016197651(A) |
申请公布日期 |
2016.11.24 |
申请号 |
JP20150076572 |
申请日期 |
2015.04.03 |
申请人 |
SHIMADZU CORP |
发明人 |
MISHINA KEN;SARUWATARI TETSUYA;OGISHI ATSUFUMI |
分类号 |
H01L21/318;C23C16/02;C23C16/42;H01L31/0216;H01L31/068 |
主分类号 |
H01L21/318 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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