发明名称 THIN FILM AND FORMING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thin film which is formed on a p-type semiconductor region and which can produce a high passivation effect; and provide a forming method of the thin film.SOLUTION: A thin film forming method comprises: a step of storing inside a chamber, a semiconductor substrate having a principal surface of a p-type semiconductor region; a step of exciting plasma of a hydrogen-containing process gas inside the chamber; a step of exposing the principal surface to the plasma of the process gas to cause a hydrogen radical to form a bond with a dangling bond of the semiconductor substrate; a step of exciting plasma of a material gas inside the chamber by hollow cathode discharge using AC power of a frequency of not less than 40 kHz and not more than 550 kHz; and a step of exposing the principal surface to the plasma containing the material gas to form a thin film which is made of a silicon nitride film and has a refraction index of 2.25 and over in contact with the principal surface.SELECTED DRAWING: Figure 6
申请公布号 JP2016197651(A) 申请公布日期 2016.11.24
申请号 JP20150076572 申请日期 2015.04.03
申请人 SHIMADZU CORP 发明人 MISHINA KEN;SARUWATARI TETSUYA;OGISHI ATSUFUMI
分类号 H01L21/318;C23C16/02;C23C16/42;H01L31/0216;H01L31/068 主分类号 H01L21/318
代理机构 代理人
主权项
地址