| 摘要 |
A common connecting section 26 for connection to terminals at the same potential in circuits is placed outside a mold section to allow a reduction in size of a semiconductor module 1. Since the common connecting section 26 is a portion of a lead frame 25 which would be placed within such a mold section in a conventional semiconductor module, the mold section can be reduced in size as compared with the conventional one, thereby reducing the amount of mold resin and the material cost. |
