| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame with resin capable of preventing an outside resin portion from dropping out from a space between a die pad and a lead portion, and to provide a lead frame, and a semiconductor device.SOLUTION: A lead frame with resin 30 comprises: a die pad 11 on which an LED element is mounted; and a lead portion 12 provided around the die pad 11 via a space 13. The die pad 11 and the lead portion 12 comprise opposite surfaces 14 and 15 facing to each other via the space 13, respectively. The opposite surface 14 of the die pad 11 and the opposite surface 15 of the lead portion 12 are each formed in unevenness. Moreover, an outside resin portion 23 for filling the space 13 between the die pad 11 and the lead portion 12 is provided. |
