发明名称 |
MICROMACHINED ULTRASONIC TRANSDUCER DEVICES WITH METAL-SEMICONDUCTOR CONTACT FOR REDUCED CAPACITIVE CROSS-TALK |
摘要 |
Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements. |
申请公布号 |
EP2946416(A4) |
申请公布日期 |
2016.11.02 |
申请号 |
EP20140749312 |
申请日期 |
2014.01.30 |
申请人 |
FUJIFILM DIMATIX, INC. |
发明人 |
HAJATI, ARMAN;LATEV, DIMITRE;GARDNER, DEANE;LAW, HUNG-FAI STEPHEN |
分类号 |
H01L41/113;B06B1/02;B06B1/06 |
主分类号 |
H01L41/113 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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