| 摘要 |
PROBLEM TO BE SOLVED: To form a component built-in substrate collectively laminated so that the rear surface of an electronic component and the surface of an insulating layer form the same surface.SOLUTION: A component built-in substrate 1 is collectively laminated by thermally pressing a first and second printed wiring base materials 10 and 20 and houses an electronic component 90 connected to the first printed wiring base material 10 in a housing part 29 formed by penetrating the second printed wiring base material 20. A method for manufacturing the component built-in substrate 1 comprises: connecting the re-wiring electrodes 91 of the electronic component 90 to vias 14 of the first printed wiring base material 10 to temporarily fix the electronic component 90; positioning the electronic component 90 to be housed in the housing part 29 of the second printed wiring base material 20; laminating the first and second printed wiring base materials 10 and 20; heat-pressing from both sides in a lamination direction to perform a collective lamination; and forming a solder resist 8. |
