| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for suppressing occurrence of negative warp in a wiring board after firing.SOLUTION: In a wiring board, the diameters of through conductors included in the ceramic insulation layer of the same layer have the same size entirely, and the diameter of a through conductor included in at least one of a plurality of ceramic insulation layers has a size different from that of a through conductor included in the ceramic insulation layer of other layer. When the thickness of the wiring board in the lamination direction is divided into two, and the upper side is defined as upper layer, the lower side is defined as lower layer, the total of volume of the wiring layer included in the upper layer is defined as Vc1 (mm), the total of volume of the through conductors included in the upper layer is defined as Vp1 (mm), the total of volume of the wiring layer included in the lower layer is defined as Vc2 (mm), and the total of volume of the through conductors included in the lower layer is defined as Vp2 (mm), following relational expression is satisfied; Vc1+Vp1≤Vc2+Vp2. |
