| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic multilayer substrate in which a conductor layer of fine pitch can be formed accurately with no positional deviation.SOLUTION: A bonding ceramic sheet 33 formed in a sheet shape while containing a ceramic material, an adhesive, and a thermally fusible organic compound is prepared. An unbaked conductor 41 is formed on the surface of a transfer film. The bonding ceramic sheet 33 is heated to a temperature equal to or higher than the melting point of the organic compound, and the transfer film is pressed against the bonding ceramic sheet 33 in a state expressing adhesion, thus transferring the unbaked conductor 41. After laminating a plurality of bonding ceramic sheets 33, each bonding ceramic sheet 33 is pressed in the lamination direction in a state where it is heated to a temperature equal to or higher than the melting point of the organic compound so as to express adhesion. As a result, an unbaked ceramic laminate 42 where respective bonding ceramic sheets 33 are integrated is formed. |
