| 摘要 |
PROBLEM TO BE SOLVED: To realize a power source device which achieves downsizing of the power source device and improves heat radiation performance of a power source module.SOLUTION: A power source device 100 includes: guide members 61, 71 provided at both sides of a power source module 11; and guide rails 62, 62 attached to both inner sides of an attachment slot 10 so as to guide the guide members 61, 71. The power module 11 has a heat radiation fin 70 for suppressing temperature rise of a semiconductor element 60 on at least one side. At least one of the guide members 61, 71 at both sides is formed by blades 71 of the heat radiation fin 70. |
