| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination method and a lamination system by which a film-like laminate can be laminated well without damaging it even in the case of a brittle object to be laminated, such as a thinned semiconductor, or semiconductor including a very brittle material.SOLUTION: A lamination method for laminating a film-like laminate F to a brittle object W to be laminated comprises the steps of superposing the brittle object W to be laminated and the film-like laminate F, on each other and heating and applying a pressure to them. In the lamination method, the step of applying a pressure to the brittle object W to be laminated and the film-like laminate F includes the step of swelling an elastic film material 16 toward the brittle object W to be laminated set on a work-holder member 36 and loaded into a lamination device 12 from above in a vacuum chamber C of the lamination device 12. |
