发明名称 発光モジュール装置
摘要 The invention provides a light-emitting module device which can restrain the temperature rise of light-emitting elements resulting from light emitting and obtains high light-emitting efficiency when multiple light-emitting elements are arranged with high density. The light-emitting module is characterized in that multiple light-emitting elements are mounted on a substrate with an insulation layer formed on the upper surface of a metal substrate layer. The light-emitting module device is characterized in that a heat diffusion pattern made of metal and formed by two-dimensional arrangement of a plurality of heat diffusion pattern elements forming electric conduction paths and thermal conduction paths in a mutually separated manner is formed on the upper surface of the insulation layer formed on the upper surface of the metal substrate layer of the substrate. One light-emitting element electrically and thermally connected with each heat diffusion pattern element is arranged on the upper surface of the corresponding heat diffusion pattern element of the heat diffusion pattern. The heat diffusion pattern is 50 micros thick.
申请公布号 JP5987804(B2) 申请公布日期 2016.09.07
申请号 JP20130187137 申请日期 2013.09.10
申请人 ウシオ電機株式会社 发明人 松島 竹夫
分类号 H01L33/64;F21S2/00;F21V29/10;H01L33/62 主分类号 H01L33/64
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