| 摘要 |
Semiconductor chips 9 to 12 are disposed on an insulating substrate with conductive patterns 1, and a printed circuit board with metal pins 13 is disposed above the insulating substrate with conductive patterns 1, with the semiconductor chips 9 to 12 therebetween. A plurality of external lead terminals 21, 22, 23 are fixed to the insulating substrate with conductive patterns 1, with the plurality of external lead terminals 21, 22 disposed adjacent to each other in parallel. Furthermore, metal foil pieces 15, 16, formed on front and rear surfaces of the printed circuit board with metal pins 13 respectively so as to oppose each other, are disposed above the semiconductor chips 9 to 12. |
