An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
申请公布号
EP3050095(A1)
申请公布日期
2016.08.03
申请号
EP20130894646
申请日期
2013.09.27
申请人
INTEL CORPORATION
发明人
BRAUNISCH, HENNING;EID, FERAS;ELSHERBINI, ADEL;SWAN, JOHANNA M.;NELSON, DON W.