| 摘要 |
In the present invention, in a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component (14) is positioned with reference to a mark (12) formed in a copper layer (4), when an imaginary line extending from a search center (74), which is a center of a search range (72) of a sensor, to an edge side (78) of the search range (72) is represented as a search reference line (80) and an imaginary line extending, in a state in which a mark center (76), which is the center of the mark (12), is matched with the search center (74), from the mark center (76) in the same direction as the search reference line (80) and to an outer ridgeline (25) of the mark (12) is represented as a mark reference line (82), the mark (12) is formed in a shape in which the outer ridgeline (25) of the mark (12) is present in a position where a length of the mark reference line (82) is in a range of 30% or more of the search reference line (80). |
