| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing-die bonding sheet with an adhesive layer capable of suppressing contraction of the adhesive layer associated with substrate deformation in a dicing step.SOLUTION: A dicing-die bonding sheet 10 is formed by laminating an adhesive layer 2 on a substrate 1. In the adhesive layer, storage elastic modulus at 80°C is 50000 to 5000000 Pa and a stress relaxation rate 120 seconds after a 20% torsion stress is applied under a 80°C environment is 30% to 90% in a pre-curing state. |
