| 摘要 |
The present invention pertains to a process for producing a ceramic copper-metallized wiring board, said process including: forming a film which comprises 150 to 250 zinc oxide needle crystals per μm2 on a ceramic base material by a wet method of immersing the ceramic base material in a zinc plating liquid, said zinc oxide needle crystals having a diameter of 20 to 100nm and a length of 120 to 280nm; heat-treating the resulting ceramic base material in the atmosphere at a temperature of 500 to lower than 900º; forming a copper deposit by electroless copper plating or copper electroplating; and subjecting the copper deposit to patterning with an etching resist to form a wiring pattern. According to the process, a ceramic copper-metallized wiring board which exhibit excellent adhesion and which is usable as a wiring board for a power module can be obtained. |
