ELECTRONIC COMPONENT AND OVERMOLDING PROCESS

摘要

Electronic components and overmolding processes are disclosed. The electronic component (100), such as an antenna, includes a substrate (101), an overmolding (103) bonded to at least a portion of the substrate, the overmolding being a non-planar arrangement of a polymeric material, and a conductive ink (105) positioned on the substrate between the substrate and the overmolding. The conductive ink is devoid or substantially devoid of delamination or fracture from the bonding of the overmolding to the substrate. The overmolding process includes providing a substrate, applying a conductive ink onto the substrate, and bonding an overmolding to at least a portion of the substrate, the overmolding being an arrangement of a polymeric material.