发明名称 THROUGH HOLE MACHINING DEVICE
摘要 PURPOSE:To perform through hole machining with high efficiency and accuracy by applying a mask, provided with holes corresponding to through holes, to the surface of a workpiece, and jetting solid gas two-phase jet containing fine abrasive grain to the workpiece by a nozzle, thus performing through hole machining to the workpiece. CONSTITUTION:The surface of a workpiece 20 is covered with a mask 29 provided with one or plural holes 3 of approximately square cross section. Solid-gas two-phase jet containing fine abrasive grain is then jetted at high speed by a nozzle 10 from above the mask 29. Approximately square micro through holes are thereby formed at the workpiece 20.
申请公布号 JPH04261774(A) 申请公布日期 1992.09.17
申请号 JP19910042947 申请日期 1991.02.15
申请人 SONY CORP 发明人 KURODA MASAYUKI
分类号 B24C1/00;B24C5/02;H05K3/00;H05K3/46 主分类号 B24C1/00
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