| 摘要 |
The present invention relates to an optical module. The optical module comprises: an optical bench having a first stepped surface with a first depth and a second stepped surface with a second depth which is smaller than the first depth; a silicon carrier which is positioned on the first stepped surface and includes at least one semiconductor chip mounted thereon; an arrayed waveguide grating (AWG) chip which is fixed to the second stepped surface, extends to the first stepped surface, and is chip-to-chip bonded with the silicon carrier on the first stepped surface; a lens which is positioned on an upper surface of optical bench except for the first stepped surface and the second stepped surface; and a metal package which surrounds the optical bench, the silicon carrier, and the AWG chip. A double slit having an upper slit and a lower slit is formed on one side surface of the metal package, a direct current (DC) flexible printed circuit board (FPCB) extends from an outer portion to an inner portion of the metal package through the upper slit and fixed to a support mount formed on an inner side surface of the upper slit, and a radio frequency (RF) FPCB extends from the outer portion to the inner portion of the metal package through the lower slit and fixed to the silicon carrier. The upper slit and the lower slit of the double slit are sealed by an elastic epoxy. An objective of the present invention is to provide a subminiature optical module capable of transferring a high frequency signal. |
