| 发明名称 |
WALL THICKNESS COMPENSATION DURING LASER ORIFICE DRILLING |
| 摘要 |
Methods and systems for drilling precise orifices in a wall of non-uniform thickness are provided. In one aspect, a thickness profile of at least a portion of the wall is created and the wall is irradiated with at least one laser beam to ablate a portion of the wall to thereby form an orifice in the wall. During the irradiation, one or more parameters of the least one laser beam are adjusted one or more times in accordance with the thickness profile to compensate for the non-uniform thickness of the wall. |
| 申请公布号 |
US2016151114(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201414557027 |
申请日期 |
2014.12.01 |
| 申请人 |
Resonetics, LLC |
发明人 |
Gu Rong;Wall David L.;Broude Sergey V. |
| 分类号 |
A61B18/20 |
主分类号 |
A61B18/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for drilling precise orifices in a wall of non-uniform thickness, the method comprising:
creating a thickness profile of at least a portion of the wall; and irradiating the wall with at least one laser beam to ablate a portion of the wall to thereby form an orifice in the wall, wherein during the irradiation one or more parameters of the least one laser beam are adjusted one or more times in accordance with the thickness profile to compensate for the non-uniform thickness of the wall. |
| 地址 |
Nashua NH US |
