发明名称 |
MANUFACTURING METHOD OF THIN FILM TRANSISTOR OF DISPLAY DEVICE |
摘要 |
A manufacturing method of a thin film transistor of a display device, the method including forming a gate insulating layer on a semiconductor layer; attaching a halftone mask onto the gate insulating layer; forming a channel region including a plurality of bridged grain lines formed; exposing the gate insulating layer of the channel region; forming a gate electrode layer on the halftone mask and the gate insulating layer; forming a gate electrode on the channel region by etching a portion corresponding to a boundary of the channel region of the gate electrode layer; removing the halftone mask; forming source/drain regions; forming an interlayer insulating layer on the gate electrode and the gate insulating layer; forming contact holes by etching the gate insulating layer and the interlayer insulating layer to expose the source/drain regions; and forming source/drain electrodes connected with the source/drain regions through the contact holes. |
申请公布号 |
US2016155822(A1) |
申请公布日期 |
2016.06.02 |
申请号 |
US201514749722 |
申请日期 |
2015.06.25 |
申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
SANG Hyeon Jeong;LEE Hee Young |
分类号 |
H01L29/66;H01L29/417;H01L29/06;H01L29/49;H01L21/28;H01L21/32;H01L27/32;H01L29/423 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method of a thin film transistor of a display device, the method comprising:
forming a gate insulating layer on a semiconductor layer including a polysilicon layer; attaching a halftone mask formed using a photoresist onto the gate insulating layer; forming a channel region including a plurality of bridged grain lines formed by doping impurities on the semiconductor layer; exposing the gate insulating layer of the channel region by etching a part of the halftone mask; forming a gate electrode layer on the halftone mask and the gate insulating layer; forming a gate electrode on the channel region by etching a portion corresponding to a boundary of the channel region of the gate electrode layer; removing the halftone mask; forming source/drain regions by doping impurities on both sides of the channel region of the semiconductor layer; forming an interlayer insulating layer on the gate electrode and the gate insulating layer; forming contact holes by etching the gate insulating layer and the interlayer insulating layer to expose the source/drain regions; and forming source/drain electrodes connected with the source/drain regions through the contact holes. |
地址 |
Yongin-City KR |