| 摘要 |
PROBLEM TO BE SOLVED: To provide an alignment method which enables semiconductor chips to be aligned one by one when the semiconductor chips are aligned and prevents damage of the chips during alignment, and to provide an alignment device.SOLUTION: A semiconductor chip alignment method of the invention includes: a supply step where semiconductor chips are supplied while being laminated with each other; and an alignment step where the semiconductor chips are separated from each other so that overlapping portions are eliminated. The semiconductor chip alignment method further includes a moving step where positions of the semiconductor chips separated from each other are detected, the semiconductor chips are held on the basis of detected position data, and the held semiconductor chips are transferred aligned in a predetermined direction.SELECTED DRAWING: Figure 1 |
