发明名称 |
BONDING COMPOSITION |
摘要 |
To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles. A bonding composition containing inorganic metallic particles and organic components including unsaturated hydrocarbon and amine with 4 to 7 of carbon number |
申请公布号 |
EP2907602(A4) |
申请公布日期 |
2016.06.01 |
申请号 |
EP20130844912 |
申请日期 |
2013.10.03 |
申请人 |
BANDO CHEMICAL INDUSTRIES, LTD. |
发明人 |
WATANABE, TOMOFUMI;SHIMOYAMA, KENJI |
分类号 |
B22F1/02;B22F1/00;B22F9/24;B23K35/02;B23K35/22;B23K35/30;B82Y30/00;C07F1/00;C09J1/00;H01L21/52 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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