发明名称 METHOD OF FABRICATING STACKED FILM
摘要 The present invention relates to a fabricating method of a stacked film which reduces particle occurrence and a manufacturing cost, and comprises the steps of: sequentially forming a nitride film and an oxide film on a substrate located in a chamber through an in-situ process; prior to forming the oxide film after forming the nitride film, performing a first plasma process under a first atmosphere containing O_2 in the chamber; and after forming the oxide film, performing a second plasma process under a second atmosphere containing O_2 in the chamber. The method performs a cycle of the above-mentioned steps at least one time. The nitride film forming step comprises a step of providing a first source gas containing carbon (C) onto the substrate. The oxide film forming step comprises a step of providing a second source gas containing carbon (C) onto the substrate.
申请公布号 KR20160061129(A) 申请公布日期 2016.05.31
申请号 KR20140163648 申请日期 2014.11.21
申请人 WONIK IPS CO., LTD. 发明人 CHOI, YOUNG CHUL;KIM, YOUNG HYO;KIM, YOUNG JUN
分类号 H01L21/31;H01L21/205;H01L21/316;H01L21/318 主分类号 H01L21/31
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