发明名称 |
METHOD OF FABRICATING STACKED FILM |
摘要 |
The present invention relates to a fabricating method of a stacked film which reduces particle occurrence and a manufacturing cost, and comprises the steps of: sequentially forming a nitride film and an oxide film on a substrate located in a chamber through an in-situ process; prior to forming the oxide film after forming the nitride film, performing a first plasma process under a first atmosphere containing O_2 in the chamber; and after forming the oxide film, performing a second plasma process under a second atmosphere containing O_2 in the chamber. The method performs a cycle of the above-mentioned steps at least one time. The nitride film forming step comprises a step of providing a first source gas containing carbon (C) onto the substrate. The oxide film forming step comprises a step of providing a second source gas containing carbon (C) onto the substrate. |
申请公布号 |
KR20160061129(A) |
申请公布日期 |
2016.05.31 |
申请号 |
KR20140163648 |
申请日期 |
2014.11.21 |
申请人 |
WONIK IPS CO., LTD. |
发明人 |
CHOI, YOUNG CHUL;KIM, YOUNG HYO;KIM, YOUNG JUN |
分类号 |
H01L21/31;H01L21/205;H01L21/316;H01L21/318 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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