发明名称 |
Method of forming a bipolar transistor with maskless self-aligned emitter |
摘要 |
Embodiments of the present invention include a method for forming a semiconductor emitter and the resulting structure. The invention comprises forming an epitaxial base layer on a semiconductor substrate. A dielectric layer is deposited over the epitaxial base layer. An opening is etched in a portion of the dielectric layer exposing a portion of the epitaxial base layer and a spacer is deposited along the sidewall of the opening. The emitter is grown from the epitaxial base layer to overlap the top surface of the spacer and a portion of the dielectric layer. The single crystal emitter is formed without a mask and without the requirement of subsequent patterning processes. |
申请公布号 |
US9356097(B2) |
申请公布日期 |
2016.05.31 |
申请号 |
US201313926644 |
申请日期 |
2013.06.25 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Harame David L.;Kaushal Vikas K.;Khater Marwan H.;Liu Qizhi |
分类号 |
H01L31/0328;H01L29/08;H01L29/66;H01L29/417;H01L29/732;H01L29/737;H01L29/45;H01L29/06 |
主分类号 |
H01L31/0328 |
代理机构 |
Roberts Mlotkowski Safran & Cole, P.C. |
代理人 |
Lestrange Michael;Calderon Andrew M.;Roberts Mlotkowski Safran & Cole, P.C. |
主权项 |
1. A method of forming a semiconductor emitter, the method comprising the steps of:
forming at least an epitaxial base layer on a semiconductor substrate; depositing a dielectric layer directly on top of the epitaxial base layer, which is used as an etch stop to protect the epitaxial base layer during a subsequent etching process; etching a portion of the dielectric layer to form an opening exposing at least a portion of the epitaxial base layer; depositing a spacer along a sidewall of the opening, wherein a portion of the dielectric layer extends past the sidewall in a plane parallel to the epitaxial base layer; and forming an emitter, where the emitter grows from the epitaxial base layer in a <100> crystal direction to overlap a top surface of the spacer and a portion of the dielectric layer. |
地址 |
Grand Cayman KY |