发明名称 Method of forming a bipolar transistor with maskless self-aligned emitter
摘要 Embodiments of the present invention include a method for forming a semiconductor emitter and the resulting structure. The invention comprises forming an epitaxial base layer on a semiconductor substrate. A dielectric layer is deposited over the epitaxial base layer. An opening is etched in a portion of the dielectric layer exposing a portion of the epitaxial base layer and a spacer is deposited along the sidewall of the opening. The emitter is grown from the epitaxial base layer to overlap the top surface of the spacer and a portion of the dielectric layer. The single crystal emitter is formed without a mask and without the requirement of subsequent patterning processes.
申请公布号 US9356097(B2) 申请公布日期 2016.05.31
申请号 US201313926644 申请日期 2013.06.25
申请人 GLOBALFOUNDRIES INC. 发明人 Harame David L.;Kaushal Vikas K.;Khater Marwan H.;Liu Qizhi
分类号 H01L31/0328;H01L29/08;H01L29/66;H01L29/417;H01L29/732;H01L29/737;H01L29/45;H01L29/06 主分类号 H01L31/0328
代理机构 Roberts Mlotkowski Safran & Cole, P.C. 代理人 Lestrange Michael;Calderon Andrew M.;Roberts Mlotkowski Safran & Cole, P.C.
主权项 1. A method of forming a semiconductor emitter, the method comprising the steps of: forming at least an epitaxial base layer on a semiconductor substrate; depositing a dielectric layer directly on top of the epitaxial base layer, which is used as an etch stop to protect the epitaxial base layer during a subsequent etching process; etching a portion of the dielectric layer to form an opening exposing at least a portion of the epitaxial base layer; depositing a spacer along a sidewall of the opening, wherein a portion of the dielectric layer extends past the sidewall in a plane parallel to the epitaxial base layer; and forming an emitter, where the emitter grows from the epitaxial base layer in a <100> crystal direction to overlap a top surface of the spacer and a portion of the dielectric layer.
地址 Grand Cayman KY