发明名称 CUTTING METHOD OF BRITTLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To practice cutting along a trench line having no crack in a simple step.SOLUTION: A nick is formed at a starting point N1 on an end face EG of a brittle substrate 11 by mounting a blade tip on the end face EG. A first trench line TL is formed from the starting point N1 to an end point N3 by moving the blade tip mounted on the starting point N1. The first trench line TL is formed so as to be in a crackless state. A crack originating from the nick is extended from the starting point N1 to the end point N3 by applying stress to the brittle substrate 11 to cut the brittle substrate 11 along the first trench line TL.SELECTED DRAWING: Figure 2
申请公布号 JP2016098152(A) 申请公布日期 2016.05.30
申请号 JP20140237450 申请日期 2014.11.25
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SOYAMA HIROSHI
分类号 C03B33/037;B28D5/00 主分类号 C03B33/037
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