| 发明名称 |
SEMICONDUCTIVE RESIN COMPOSITION AND POWER TRANSMISSION CABLE USING SAME |
| 摘要 |
A semiconductive resin composition is composed of a base polymer including an ethylene-vinyl acetate copolymer with a vinyl acetate content of not lower than 60 percent by weight, two or more of fatty acid zinc, oleic acid bisamide and trimellitic acid ester, a peroxide-based crosslinking agent having a one hour half-life temperature of not lower than 130 degrees C., and a carbon having a DBP (dibutyl phthalate) adsorption capacity of not larger than 150 mg/g. |
| 申请公布号 |
US2016148717(A1) |
申请公布日期 |
2016.05.26 |
| 申请号 |
US201514819873 |
申请日期 |
2015.08.06 |
| 申请人 |
Hitachi Metals, Ltd. |
发明人 |
KIKUCHI Ryutaro;Setogawa Akira |
| 分类号 |
H01B1/24 |
主分类号 |
H01B1/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductive resin composition, comprising:
a base polymer including an ethylene-vinyl acetate copolymer with a vinyl acetate content of not lower than 60 percent by weight; two or more of fatty acid zinc, oleic acid bisamide and trimellitic acid ester; a peroxide-based crosslinking agent having a one hour half-life temperature of not lower than 130 degrees C.; and a carbon having a DBP (dibutyl phthalate) adsorption capacity of not larger than 150 mg/g. |
| 地址 |
Tokyo JP |
