发明名称 |
CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING ELEMENT |
摘要 |
The present invention relates to a curable resin composition comprising (A) an epoxy compound having three or more epoxy groups in one molecule and (B) an active hydrogen compound. |
申请公布号 |
EP2995634(A4) |
申请公布日期 |
2016.05.25 |
申请号 |
EP20140793985 |
申请日期 |
2014.05.01 |
申请人 |
ASAHI KASEI CHEMICALS CORPORATION |
发明人 |
KAJI SATORU;WATANABE RYOKO;KODAMA TAMOTSU |
分类号 |
C08G59/32;C08L63/00;C08L83/06;H01L23/29;H01L23/31;H01L33/56 |
主分类号 |
C08G59/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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