Memory Device Constructions, Memory Cell Forming Methods, and Semiconductor Construction Forming Methods

摘要

Memory device constructions include a first column line extending parallel to a second column line, the first column line being above the second column line; a row line above the second column line and extending perpendicular to the first column line and the second column line; memory material disposed to be selectively and reversibly configured in one of two or more different resistive states; a first diode configured to conduct a first current between the first column line and the row line via the memory material; and a second diode configured to conduct a second current between the second column line and the row line via the memory material. In some embodiments, the first diode is a Schottky diode having a semiconductor anode and a metal cathode and the second diode is a Schottky diode having a metal anode and a semiconductor cathode.

主权项

1: A semiconductor construction forming method comprising:
forming a first semiconductor material over the substrate, a second semiconductor material over the first semiconductor material, a third semiconductor material over the second semiconductor material, and a fourth semiconductor material over the third semiconductor material wherein the first and second semiconductor materials comprise different dopants relative to one another and the third and fourth semiconductor materials comprise different dopants relative to one another; etching a first trench extending entirely through the fourth semiconductor material and partially through the third semiconductor material; depositing an insulative material on a sidewall of the trench, the insulative material being in contact with the first semiconductor material and the second semiconductor material; etching a second trench extending from a bottom surface of the first trench entirely through the third semiconductor material and partially through the second semiconductor material; depositing a metal on a sidewall of the second trench, the metal being in contact with the insulative material, the third semiconductor material, and the second semiconductor material; reacting the metal with the third semiconductor material and the second semiconductor material so that a first portion of the third semiconductor material and a second portion of the second semiconductor material comprise a metal silicide, the first portion and the second portion being below the insulative material; and wherein the first and second semiconductor materials together form a first diode, the third and fourth semiconductor materials together form a second diode, and the first and second portions form a conductive electrode between the first diode and the second diode.