发明名称 High-frequency power amplifier and method for manufacturing the same
摘要 A high-frequency power amplifier includes: a semiconductor substrate; transistor cells separated from each other and located on the semiconductor substrate; and testing electrodes respectively connected to individual transistor cells, wherein an electrical signal and power to individually operate each corresponding transistor cell are supplied to each transistor cell, independently, from outside, using the testing electrodes.
申请公布号 US9343380(B2) 申请公布日期 2016.05.17
申请号 US201414535475 申请日期 2014.11.07
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 Sato Kunihiro;Chaki Shin;Yamasaki Takashi;Yoshioka Takaaki
分类号 G01R19/00;H03F3/68;H01L21/66;H03F3/19;H03F3/24 主分类号 G01R19/00
代理机构 Leydig, Voit & Mayer, Ltd. 代理人 Leydig, Voit & Mayer, Ltd.
主权项 1. A high-frequency power amplifier comprising: a semiconductor substrate; a plurality of transistor cells separated from each other and located on the semiconductor substrate; and a plurality of testing electrodes located on the semiconductor substrate, wherein respective testing electrodes of the plurality of testing electrodes are only connected to respective corresponding transistor cells of the plurality of transistor cells so that an electrical signal and power for operating each respective corresponding transistor cell can be supplied to each respective corresponding transistor cell individually, from outside the respective corresponding transistor cell, using the testing electrode connected to the respective corresponding transistor cell, without applying the electrical signal and power to any other transistor cell of the plurality of transistor cells.
地址 Tokyo JP