| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry film that satisfies required performances as an insulation film of a flexible printed wiring board and allows formation of a structure suitable for a collective formation process for a bending part and a mounting part, and to provide a flexible printed wiring board having a cured product of the dry film as a protective film, for example, as a coverlay or a solder resist.SOLUTION: The dry film includes an adhesion surface (a) to be laminated on a protection object and a protective surface (b) located on the opposite side to the adhesion surface. In an infrared absorption spectrum obtained by an ATR (attenuated total reflection) method of FT-IR (Fourier transformation infrared spectroscopy), the adhesion surface (a) does not show a peak derived from imide while the protective surface (b) shows the peak. The dry film is alkali-soluble.SELECTED DRAWING: Figure 1 |
