| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device provided with an insulation resin layer and capable of exhibiting sufficient reliability and connection reliability.SOLUTION: Provided is a semiconductor device comprising: a first base material including a first terminal; a second base material including a second terminal; and a joining part joining the first terminal and the second terminal. The insulation resin layer is formed from a resin composition at least including a filler, and the filler derived from the resin composition is included at the inside of the joining part.SELECTED DRAWING: Figure 2 |
