Method and a system for recognizing voids in a bump

摘要

A method and a system for bump's inspection are disclosed. The inspection done by comparing the volume of the bump's outside contour and the volume the solid materials from which the bump is made and/or analyzing the bump's solid materials ratio. Principally, the inspection id done by preparing an empiric reference table of the emitted energy received from the solid materials, from which a reference proper bump with a given volume is comprised, using ED-XRF (Energy-Dispersive-X-ray-Fluorescence analysis) analyze; obtaining a first calculated volume of the bump, using a 3D image-processing method; adapting the reference table according to the difference between the given volume and the first calculated volume of the bump; performing a second volume calculation of the bump by applying ED-XRF technology. The difference between the first and second volume calculations and the solid material combination are used to inspect the bump.

主权项

1. A method for the detection of the presence of a void within a bump comprising solid materials and having a particular outside contour, and for the determination of the volume of said void within said bump, comprising the steps of:
determining the volume of said outside contour of said bump; determining the volume of said solid materials from which said bump is made; and comparing the volume of said solid materials comprising said bump with said volume of said outside contour of said bump, whereby if said volume of said solid materials comprising said bump is less than said volume of said outside contour of said bump, then at least one void exists within said bump and the volume of said at least one void located within said bump comprises the difference between said volume of said outside contour of said bump and said volume of said solid materials comprising said bump.