发明名称 SUBSTRATE POLISHING DEVICE AND SUBSTRATE POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate polishing device that is advantageous for improving polishing efficiency and space saving.SOLUTION: A substrate polishing device 100 comprises a substrate holder 10 for holding a substrate S and a polishing pad holder 50 for holding a polishing pad P; and brings the substrate S into contact with the polishing pad P to polish the substrate S with the polishing pad P. The substrate holder 10 comprises: a ring gear 12 having inner teeth 121 in an inner periphery thereof; a pinion gear 13 that is provided inside the ring gear 12 and has outer teeth 131 engaging with the inner teeth 121 of the ring gear 12; a cam shaft 14 that makes the ring gear 12 revolve with a central axis Oof the pinion gear 13 as a revolution center while maintaining engagement of the ring gear 12 with the pinion gear 13 and thus, rotates the ring gear 12; and a substrate holding member 11 fixed to the ring gear 12 and used for holding the substrate S.SELECTED DRAWING: Figure 1
申请公布号 JP2016068219(A) 申请公布日期 2016.05.09
申请号 JP20140201582 申请日期 2014.09.30
申请人 EBARA CORP 发明人 ISHIBASHI TOMOATSU
分类号 B24B37/10;B24B37/00;B24B37/005;H01L21/304 主分类号 B24B37/10
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