| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for sensor node, breakdown of which caused by collision (e.g., cracking, chipping and breaking) is reduced effectively.SOLUTION: In a package for sensor node having a substantially plate-shaped housing of 1 cm thick or more, formed of a ceramic material, a step is formed at the boundary of at least any one of two principal surfaces of the housing, and the outer peripheral end face, and the width of the step is 0.16 mm or more.SELECTED DRAWING: Figure 2 |
