| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily prevent resin leakage from an encapsulated resin body to a gap of tie bars in a resin encapsulation process without improving reliability of manufacturing facilities such as a transfer mold device and a mold.SOLUTION: A semiconductor device of the present embodiment comprises a resin encapsulated body, lead terminals and tie bars. The tie bar includes a recess on the side of the resin encapsulated body side. The recess is opened to guide a flow of a resin leaked from the resin encapsulated body and includes an easy deformation part.SELECTED DRAWING: Figure 1 |
