发明名称 Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board
摘要 An apparatus for determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit is presented. The assembly comprises a testing printed circuit board (PCB) having an integrated circuit (IC) test region located thereon. Vias extend through the testing PCB from a surface to an underside thereof within the IC test region. Each via has an IO pad or ground pad electrically connectable thereto. An IC package having an IC die connected thereto by solder bumps is connected to the IC test region by solder balls, such that each of the IO pads is electrically connectable to a respective pair of the solder balls and solder bumps by the vias. A method of testing interconnection reliability of the BGA using the apparatus is also presented.
申请公布号 US9329227(B2) 申请公布日期 2016.05.03
申请号 US201213659425 申请日期 2012.10.24
申请人 Nvidia Corporation 发明人 Xie Dongji;Woo Min
分类号 G01R31/26;G01R31/28;G01R1/04;G01R31/04 主分类号 G01R31/26
代理机构 代理人
主权项 1. A method of determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit, comprising: stressing an integrated circuit (IC) package electrically connectable to a testing printed circuit board (PCB) by solder balls, said IC package having an IC die electrically connectable thereto by solder bumps, said testing PCB having IO and ground pads located on an underside thereof and within an IC test region, wherein each of said ground and IO pads is respectively, electrically connectable to a different pair of said solder balls and solder bumps to allow for individual pin testing in said IC package; and testing an electrical continuity of said solder balls and solder bumps of said IC package after said IC package is stressed by applying a current through said IO to ground pads or through ground to ground pads connected to said different pairs of said solder balls and solder bumps, wherein said ground pads are reference ground pads, and said testing includes measuring a resistance of an electrical path between a solder ball connected to one of said reference ground pads and a solder bump of said at least one of said pair of solder balls and solder bumps, or wherein testing includes measuring a resistance of an electrical path between said IC die and said at least one of said pair of solder balls or solder bumps.
地址 Santa Clara CA US