SEMICONDUCTOR, METHOD OF MANUFACTURING THE SAME AND STACKED TYPE PACKAGE USING THEROF

摘要

The present invention relates to a semiconductor package, a method for manufacturing the same, and a stacked type package using the same. According to an embodiment of the present invention, the semiconductor package comprises: a first substrate; a first molding unit formed on an upper portion of the first substrate, and having a component mounting groove formed therein; a first component arranged in the component mounting groove; and a first mold via formed to penetrate the first molding unit in a lower portion of the component mounting groove, and configured to electrically connect the first substrate to the first component. Therefore, the thickness of the semiconductor package can be reduced.