发明名称 |
METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE |
摘要 |
A method for bonding a first substrate and a second substrate, the first substrate having at least one first connection extending from one side of the first substrate, the method comprising fabricating a first adhesive material around and along a height of the at least one first connection; and bonding the at least one first connection, the first adhesive material, and the second substrate. |
申请公布号 |
WO2016064350(A1) |
申请公布日期 |
2016.04.28 |
申请号 |
WO2015SG50407 |
申请日期 |
2015.10.23 |
申请人 |
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
XIE, LING;WICKRAMANAYAKA, SUNIL |
分类号 |
H01L23/48;H01L21/60;H01L21/768;H01L25/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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