| 发明名称 |
LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE |
| 摘要 |
A laminated substrate includes: a core portion; a first wiring portion configured to be stacked on the core portion and to include a first exposed surface formed by exposing at least part of a surface of the first wiring portion; and a second wiring portion configured to be stacked on the first wiring portion, to include a second exposed surface formed by exposing at least part of a surface of the second wiring portion, and to have higher wiring density of conductor than the first wiring portion has, wherein the first exposed surface and the second exposed surface are provided respectively with a first pad and a second pad which are to be connected to electrodes of one semiconductor chip to be mounted on both the first exposed surface and the second exposed surface. |
| 申请公布号 |
US2016118322(A1) |
申请公布日期 |
2016.04.28 |
| 申请号 |
US201514837131 |
申请日期 |
2015.08.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KANDA Takashi;BABA Shunji |
| 分类号 |
H01L23/498;H01L21/48;H05K1/11 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A laminated substrate comprising:
a core portion; a first wiring portion configured to be stacked on the core portion and to include a first exposed surface formed by exposing at least part of a surface of the first wiring portion; and a second wiring portion configured to be stacked on the first wiring portion, to include a second exposed surface formed by exposing at least part of a surface of the second wiring portion, and to have higher wiring density of conductor than the first wiring portion has, wherein the first exposed surface and the second exposed surface are provided respectively with a first pad and a second pad which are to be connected to electrodes of one semiconductor chip to be mounted on both the first exposed surface and the second exposed surface. |
| 地址 |
Kawasaki-shi JP |
