METHOD FOR CUTTING SUBSTRATE

摘要

A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

主权项

1. A method for cutting a substrate, comprising:
a first laser radiating process radiating a laser towards a surface of the substrate to form a first groove in the surface; and a second laser radiating process radiating a laser towards the surface of the first groove to form a second groove, wherein:
the first laser radiating process comprises radiating, in sequence, the laser towards a first outer point, a second outer point, a first intermediate point, a second intermediate point, and a first cut point of the surface;the second laser radiating process comprises radiating, in sequence, the laser towards a second cut point, a third outer point, a fourth outer point, a third intermediate point, and a fourth intermediate point of the first groove;the first outer point, the second outer point, the first intermediate point, the second intermediate point, and the first cut point are spaced apart from one another by one or more distances;the first cut point corresponds to a cut line of the substrate;the first outer point and the second outer point are respectively disposed at a first lateral side and a second lateral side of the first cut point;the first intermediate point is disposed between the first cut point and the first outer point;the second intermediate point is disposed between the first cut point and the second outer point; andthe second cut point, the third outer point, the fourth outer point, the third intermediate point, and the fourth intermediate point are disposed below the first cut point, the first outer point, the second outer point, the first intermediate point, and the second intermediate point, respectively.