| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module in which an electrode layer of a semiconductor element and an electrode terminal are electrically connected by pressure welding, which reduces a contact pressure applied between constructional elements composing the semiconductor module. <P>SOLUTION: A semiconductor module 1 comprises: semiconductor elements 2a, 2b; an AC electrode terminal 3; DC electrode terminals 4, 5; and a radiator 6. The radiator 6 includes a lid member 8, a heat sink 9 provided to be opposed to the lid member 8 and a spring 10. By providing the lid member 8 and the heat sink in the opposed manner, a refrigerant path 12 is formed and the spring 10 is provided in the refrigerant path 12 and on an extended line in a direction vertical to an electrode plane of the semiconductor element 2a (or semiconductor element 2b). The AC electrode terminal 3 (or DC electrode terminals 4, 5) are pressed in a direction toward the semiconductor element 2a (or semiconductor element 2b) by the spring 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
