| 发明名称 |
ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD |
| 摘要 |
The adhesive composition according to the present invention contains a block copolymer, and an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23°C, a storage modulus (G') of 1.5 × 10 5 Pa or less at 220°C, and a loss factor (tan Ã) of 1.3 or less at 220°C. |
| 申请公布号 |
EP2837668(B1) |
申请公布日期 |
2016.04.27 |
| 申请号 |
EP20130776012 |
申请日期 |
2013.03.14 |
| 申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
TAMURA, KOKI;IMAI, HIROFUMI;OGATA, TOSHIYUKI;KUBO, ATSUSHI;YOSHIOKA, TAKAHIRO |
| 分类号 |
C09J153/00;C09J5/00;C09J7/02;C09J153/02;H01L21/304;H01L21/683 |
主分类号 |
C09J153/00 |
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