发明名称 |
Via-structure of a multilayer interconnection ceramic substrate. |
摘要 |
A via-structure of a multilayer interconnection ceramic substrate for a multi-chip module, a semiconductor package and an insulating substrate has a high strength and a high reliability being produced at a low cost. A gap is provided at an interface between a via-conductor and ceramics, and filled with a resin. The resin is preferably of a thermo-setting polyimide resin or a benzo-cyclo-butene resin. <IMAGE> |
申请公布号 |
EP0682363(A3) |
申请公布日期 |
1997.05.14 |
申请号 |
EP19950107251 |
申请日期 |
1995.05.12 |
申请人 |
NEC CORPORATION |
发明人 |
SHIBUYA, AKINOBU;KIMURA, MITSURU |
分类号 |
H05K3/46;H01L21/48;H01L23/498;H01L23/538 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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