| 摘要 |
Provided is an epoxy resin based molding material for sealing, said molding material comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a mono- or di-hydric phenol derivative containing one or more nitrile groups in the molecular structure. It is preferable that the content of the mono- or di-hydric phenol derivative (C) is 0.1 to 1.0% by mass. Further, it is preferable that the molding material contains (D) a silane compound, (E) a cure accelerator, and/or (F) an inorganic filler. Also provided is an electronic part or device that is provided with an element sealed with the epoxy resin based molding material. |
