| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of simplifying a manufacturing step.SOLUTION: A first mask 110 is formed on one surface 100a of a lead frame material 100, and a second mask 120 is formed on the other surface 100b. Then, the second mask 120 is patterned, and half etching is performed from the other surface 100b side of the lead frame material 100. Next, a film material 130 whose adhesive force can be changed is disposed on the other surface 100b of the lead frame material 100 so as to bury a part removed by the half etching. Thereafter, the first mask 110 is patterned, and etching is performed from the one surface 100a side of the lead frame material 100, and then, a mounting part 10 and a terminal part 11 are formed. Then, a semiconductor element 20 is mounted on the mounting part 10, and the semiconductor element 20 is encapsulated with a mold resin 30 so as to expose the film material 130, and then, the adhesive force of the film material 130 is weakened to remove the film material 130. |
